PRINTED CIRCUIT BOARD TRANSMISSION BELT LINE AND ELECTRONIC DEVICE

Title:

PRINTED CIRCUIT BOARD TRANSMISSION BELT LINE AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/228208

Kind Code:

A1

Abstract:

Disclosed in embodiments of the present application is a printed circuit board transmission belt line, for relieving the acting force to at least one first soldering point when a metal part is expanded. The printed circuit board transmission belt line comprises a substrate layer, a metal belt line, at least one first soldering point, at least one first transmission medium, and a metal part for realizing a grounding function. The metal belt line is plated on the surface of substrate layer. The at least one first soldering point is a soldering point where the metal belt line is connected to the at least one first transmission medium. The at least one first soldering point is soldered to the metal belt line, and is soldered to the at least one first transmission medium. The metal part is soldered to the at least one first transmission medium. At least one groove is formed at one side of the at least one first soldering point. The at least one groove is used for relieving the acting force to the at least one first soldering point when the metal part is expanded.

Inventors:

WU YIYAO (CN)
MA XINBO (CN)
LIAO ZHIQIANG (CN)

Application Number:

PCT/CN2019/087571

Publication Date:

December 05, 2019

Filing Date:

May 20, 2019

Export Citation:

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Assignee:

HUAWEI TECH CO LTD (CN)

International Classes:

H01R43/02; H01R12/53

Foreign References:

CN102570081A	2012-07-11
CN106165201A	2016-11-23
JP2014143104A	2014-08-07
JP2014157794A	2014-08-28
CN201810535150A	2018-05-29

Other References: