Title:
PRINTED CIRCUIT BOARD WIRE BONDING METHOD AND PRINTED CIRCUIT BOARD WIRE BONDING STRUCTURE FORMED BY SAME
Document Type and Number:
WIPO Patent Application WO/2015/152432
Kind Code:
A1
Abstract:
The present invention relates to a printed circuit board wire bonding method and a printed circuit board wire bonding structure formed by the same. The printed circuit board wire bonding method, according to one specific embodiment, comprises the steps of: stacking a semiconductor chip on a substrate having an electrode; forming a metal pad on a predetermined portion of the electrode; and electrically connecting the semiconductor chip and the metal pad by using an aluminum wire, wherein the connecting comprises the steps of: forming a first bonding part by bonding a first end portion of the aluminum wire onto a predetermined portion of the semiconductor chip by using ultrasonic waves; and forming a second bonding part by bonding a second end portion of the aluminum wire onto a predetermined portion of the metal pad by using ultrasonic waves.
Inventors:
YU JUNG HO (KR)
KIM YOUNG GEUN (KR)
HAN HYUNG MIN (KR)
JANG YOUNG HOON (KR)
KIM YONG KWANG (KR)
KIM HEE JUNG (KR)
KIM YOUNG GEUN (KR)
HAN HYUNG MIN (KR)
JANG YOUNG HOON (KR)
KIM YONG KWANG (KR)
KIM HEE JUNG (KR)
Application Number:
PCT/KR2014/002721
Publication Date:
October 08, 2015
Filing Date:
March 31, 2014
Export Citation:
Assignee:
DAEWOO ELECTRONIC COMPONENT (KR)
International Classes:
H05K3/32
Foreign References:
| KR910004920B1 | 1991-07-18 | |||
| JPH09260441A | 1997-10-03 | |||
| JP2008218703A | 2008-09-18 | |||
| KR900002454A | 1990-02-28 | |||
| JPH08181175A | 1996-07-12 |
Attorney, Agent or Firm:
AJU KIM CHANG & LEE (KR)
특허법인아주양헌 (KR)
특허법인아주양헌 (KR)
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