PRINTED CIRCUIT BOARD WITH NET AS SUBSTRATE

WIPO Patent Application WO/2017/092152

A1

Provided is a printed circuit board with a net as a substrate, named as a net substrate. The net substrate comprises a substrate net (1), the substrate net being a metal wire net or a metal board punching net woven in a high density mode; an upper-layer conductive layer (2), wherein a metal film or a thin printed circuit board or a flexible printed circuit board (FPC) is used for making a desired circuit graph for welding a connection element, places where no wiring and element is placed on the upper-layer conductive layer are cut off, and places where pins of a mounted element or heat sinks need to be brought into direct contact with the substrate net are perforated; and a middle bonding layer (13), wherein the middle bonding layer is a prepreg or a high temperature-resistant adhesive, the substrate net (1) and the upper-layer conductive layer (2) are laminated as a whole using a vacuum thermal lamination process, and the pins or the heat sinks, needing to be brought into direct contact with the substrate net (1), of the element can be directly welded or bonded by using a thermal conductive adhesive on the substrate net (1). The printed circuit board with the net as the substrate can be used in fields in need of air circulation and heat dissipation, and has the advantages of a good heat dissipation effect, a light weight, flexibility, and a low cost.

JIN FENGZE (CN)
JIN BIN (CN)

PCT/CN2016/000626

June 08, 2017

November 11, 2016

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JIN FENGZE (CN)
JIN BIN (CN)

H05K1/02; H05K1/03

CN105263259A	2016-01-20
CN101630468A	2010-01-20
CN103079338A	2013-05-01
CN103517544A	2014-01-15

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