PRINTED CIRCUIT BOARD

Title:

PRINTED CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2012/039120

Kind Code:

A2

Abstract:

A multi-layer printed circuit board includes an embedded capacitor substrate composed of a power source conductor layer and a ground conductor layer, the layers being disposed close to each other. The power source conductor layer has a first power source plane to supply power to a circuit element, and a second power source plane that is separated from the first power source plane by a gap and functions as a main power source. The first power source plane is partially connected to the second power source plane by a connecting line. The ground conductor layer has an opening at a position overlapping with a projected image when the connecting line is projected on the ground conductor layer. This structure suppresses propagation of the noise caused at the circuit element and reduces radiation noise in the printed circuit board.

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Inventors:

MIYAZAKI TOYOHIDE (JP)
KOYAMA KENJI (JP)

Application Number:

PCT/JP2011/005246

Publication Date:

March 29, 2012

Filing Date:

September 16, 2011

Export Citation:

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Assignee:

CANON KK (JP)
MIYAZAKI TOYOHIDE (JP)
KOYAMA KENJI (JP)

International Classes:

H01L23/66; H05K1/02; H01L25/065; H05K1/16

Foreign References:

US5079069A	1992-01-07
JP2010214397A	2010-09-30

Attorney, Agent or Firm:

ABE, Takuma et al. (30-2 Shimomaruko 3-chome, Ohta-k, Tokyo 01, JP)

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Claims:

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