Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2013/031258
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain a printed circuit board with a high yield and having a through via hole for soldering in which material for a solder resist layer itself does not clog the via hole during patterning of the solder resist layer. Furthermore, in the present invention, the inside diameter (d11) of a printed base material passage part (11h) for the through via hole (17) and the inside diameter (d15) (of a silk layer passage part (15h)) for the through via hole (17) of a silk printing layer (15 (16)) are set to be the same. The inside diameter (d13) (of the solder resist passage part (13h)) for the through via hole (17) of the solder resist layer (13 (15)) is formed wider than the via hole diameter (d11). With the relationship above, an extended silk printing layer construction is presented in which one part of the silk printing layer (15) in a region in proximity to the through via hole (17) is directly formed on a copper pattern (12).
Inventors:
OTSU YUSUKE (JP)
Application Number:
PCT/JP2012/054204
Publication Date:
March 07, 2013
Filing Date:
February 22, 2012
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
OTSU YUSUKE (JP)
OTSU YUSUKE (JP)
International Classes:
H05K3/34; H05K3/28
Foreign References:
| JP2003318524A | 2003-11-07 | |||
| JPS6371578U | 1988-05-13 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
Hidetoshi Yoshitake (JP)
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