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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/206769
Kind Code:
A1
Abstract:
A printed circuit board (PCB) for testing strain of a printed circuit board assembly comprises: multiple electrically-conductive layers (110); insulating layers (120) separating the electrically-conductive layers (110); and a strain array layer (130) disposed between the insulating layers (120). The invention enables a stress test to be performed on an entire PCB and has a high coverage rate, thereby realizing a stress test on an entire PCB, and increasing validity and accuracy of the stress test.

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Inventors:
GONG YUNLONG (CN)
Application Number:
PCT/CN2017/085583
Publication Date:
December 07, 2017
Filing Date:
May 23, 2017
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K3/46
Foreign References:
CN1930929A2007-03-14
JPH09125264A1997-05-13
JP2000340916A2000-12-08
JP2001015882A2001-01-19
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