Title:
PRINTED CIRCUIT SUBSTRATE, PRINTED CIRCUIT, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/075239
Kind Code:
A1
Abstract:
The disclosed printed circuit board is provided with: a base film mainly composed of polyimide; and a conductive layer formed on at least one surface side of the base film. The conductive layer has a metal sintered layer formed on the base film, and an electroless plating layer formed on the metal sintered layer. In the base film, the number of voids having a maximum width of 5 μm or more in a plane view is 10 or less per a reference unit area of 0.25 mm2 in the surface of the base film.
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Inventors:
HIDANI TAKUTO (JP)
MIURA KOUSUKE (JP)
MIURA KOUSUKE (JP)
Application Number:
PCT/JP2021/036551
Publication Date:
April 14, 2022
Filing Date:
October 04, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
B32B15/088; H05K1/03; H05K3/18; H05K3/24; H05K3/38
Domestic Patent References:
| WO2019216012A1 | 2019-11-14 | |||
| WO2010095723A1 | 2010-08-26 |
Foreign References:
| JP2020057799A | 2020-04-09 | |||
| JP2003124214A | 2003-04-25 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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