PRINTED WIRING BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIPO Patent Application WO/2018/105000

A1

The purpose of the present invention is to acquire a printed wiring board on which corrosion of a copper foil pattern is effectively prevented. A printed wiring board 1 is provided with: a copper foil pattern 2 on a substrate 1a; a solder resist 3 provided uniformly on the copper foil pattern 2 so as to cover the copper foil pattern 2; and an outline character forming layer 5 provided in a portion where no character is formed such that an outline character is formed on the solder resist 3. In addition, a method for manufacturing the printed wiring board 1 includes: a step for forming the copper foil pattern 2 on the substrate 1a; a step for uniformly forming the solder resist 3, on the copper foil pattern 2, so as to cover the copper foil pattern 2; and a step for forming the outline character forming layer 5 on the solder resist 3, wherein the solder resist 3 is formed by coating according to a spraying method.

JP2003151838	COIL UNIT AND MODULE PART MOUNTING WITH THE SAME
WO/2010/002156	PRINTED CIRCUIT BOARD FOR LED LIGHT CAPABLE OF BEING EASILY CHANGED INTO POLYHEDRAL AND POLYGONAL SHAPES
WO/2011/003647	PRINTED CIRCUIT BOARD

MIURA TSUYOSHI (JP)
KOJIMA TOMOTAKA (JP)

PCT/JP2016/086041

June 14, 2018

December 05, 2016

Click for automatic bibliography generation  

MITSUBISHI ELECTRIC CORP (JP)

H05K1/02; H05K3/00; H05K3/28

JP2006319031A	2006-11-24
JP2016129181A	2016-07-14
JPH0715118A	1995-01-17
JP2002232124A	2002-08-16
JP2014107452A	2014-06-09
JP5973689B1	2016-08-23
JPH04314384A	1992-11-05

See also references of EP 3364730A4

TAKAMURA, Jun (JP)

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