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Title:
PRINTED-WIRING BOARD BASE MATERIAL AND METHOD OF MANUFACTURING PRINTED-WIRING BOARD BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/208077
Kind Code:
A1
Abstract:
A printed-wiring board base material according to an embodiment of the present disclosure is provided with an insulating base film, and a metal particle-sintered material layer stacked on at least one side of the base film, wherein the sintered material layer has sintered particles derived from the metal particles and embedded in a surface of the base film, the sintered particles having an embedded ratio of not less than 10% and not more than 90%.

Inventors:
HASHIZUME Kayo (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
YAMAMOTO Masamichi (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
Application Number:
JP2019/013276
Publication Date:
October 31, 2019
Filing Date:
March 27, 2019
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
H05K3/38
Foreign References:
JP2016110690A2016-06-20
JP2017534747A2017-11-24
Attorney, Agent or Firm:
MORITA Takeshi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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