Title:
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, PREPREG
Document Type and Number:
WIPO Patent Application WO/2018/047613
Kind Code:
A1
Abstract:
Provided are an internal insulating layer having conductor wiring, a first outermost insulating layer formed on a first surface of the internal insulating layer, and a second outermost insulating layer formed on a second surface of the internal insulating layer. The bending elastic moduli of the first outermost insulating layer and the second outermost insulating layer are ¼ to ¾ of the bending elastic modulus of the internal insulating layer. The glass transition temperatures of the first outermost insulating layer 51 and the second outermost insulating layer are within the range of ±20°C of the glass transition temperature of the internal insulating layer.
Inventors:
ITO AKIRA
SAITO EIICHIRO
YAMANOUTI KENGO
SAITO EIICHIRO
YAMANOUTI KENGO
Application Number:
PCT/JP2017/029840
Publication Date:
March 15, 2018
Filing Date:
August 22, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K3/46; H01L23/12; H01L23/14; H05K1/03
Domestic Patent References:
| WO2008069343A1 | 2008-06-12 | |||
| WO2008126817A1 | 2008-10-23 |
Foreign References:
| JP2015189834A | 2015-11-02 | |||
| JP2007329441A | 2007-12-20 |
Other References:
See also references of EP 3512315A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
Download PDF:
Previous Patent: COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Next Patent: POWER SLIDING WINDOW
Next Patent: POWER SLIDING WINDOW