Title:
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2021/002009
Kind Code:
A1
Abstract:
A printed wiring board according to an aspect of the present invention is provided with: a base film having insulating property; and a conductive pattern laminated on at least one surface side of the base film, wherein the average width of a plurality of wiring parts included in the conductive pattern is 5-20 μm inclusive, the wiring parts each have a seed layer and a plated later, the plated layer includes copper crystal surfaces (111), (200), (220), and (311), and the strength ratio IR220 of the copper crystal surface (220) obtained by formula (1) is 0.05-0.14 inclusive. (1): IR220=I220/(I111+I200+I220+I311) (in formula (1), I111, I200, I220, and I311 are X-ray diffraction intensities of (111), (200), (220) and (311), respectively)
More Like This:
Inventors:
IKEBE MAKI (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
NITTA KOJI (JP)
SAKAI SHOICHIRO (JP)
Application Number:
PCT/JP2019/026702
Publication Date:
January 07, 2021
Filing Date:
July 04, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K3/18; C25D7/00
Foreign References:
| JP2011171423A | 2011-09-01 | |||
| JP2007182623A | 2007-07-19 | |||
| JP2012169597A | 2012-09-06 | |||
| JP2013060660A | 2013-04-04 | |||
| JP2014125679A | 2014-07-07 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
Download PDF: