PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2010/035601

A1

A printed wiring board having excellent plating resistance, wherein bleed-out of a cyclic dimethylsiloxane oligomer from a protective layer which is composed of a photosensitive siloxane polyimide resin composition is sufficiently suppressed.  Specifically, a protective layer which is composed of a thermoset product of a photosensitive siloxane polyimide resin composition containing a siloxane polyimide resin, which is obtained by imidizing a tetracarboxylic acid dianhydride, a siloxane diamine having a diphenylsilylene unit and a diamine containing no siloxane, a crosslinking agent and a photoacid generator is formed on at least a part of a copper or copper alloy wiring pattern of a printed wiring board.  A certain amount of at least one substance selected from the group consisting of liquid epoxy resins, benzoxazines and resols is used as the crosslinking agent, and a certain amount of the photoacid generator is used as a sensitizer.  The surface of the copper or copper alloy wiring pattern of a printed wiring board has been subjected to a roughening treatment.

SUNAGA TOMOYASU (JP)
KANAYA HIROKI (JP)
NOMURA MAMIKO (JP)
ISHII JUNICHI (JP)
OMORI YOSHIO (JP)

PCT/JP2009/064715

April 01, 2010

August 24, 2009

Click for automatic bibliography generation  

SONY CHEM & INF DEVICE CORP (JP)
SUNAGA TOMOYASU (JP)
KANAYA HIROKI (JP)
NOMURA MAMIKO (JP)
ISHII JUNICHI (JP)
OMORI YOSHIO (JP)

H05K3/28; C08L61/00; C08L63/00; C08L79/08; H05K3/26; H05K3/38

JP2008214598A	2008-09-18
JP2008197418A	2008-08-28
JP2008184499A	2008-08-14
JP2006083307A	2006-03-30
JP2008197545A	2008-08-28
JP2008222969A	2008-09-25
JP2008163262A	2008-07-17

TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)

View/Download PDF      PDF Help

Previous Patent: PAIN RELIEF DEVICE

Next Patent: LITHIUM SULFIDE-CARBON COMPLEX, PROCESS FOR PRODUCING THE COMPLEX, AND LITHIUM ION SECONDARY BATTERY...