Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/183608
Kind Code:
A1
Abstract:
This printed wiring board has conductor patterns (12) for which the thickness t1 is at least 50 µm provided on an insulated substrate (11), an insulating layer (5) being provided on a conductor pattern (L) and on an insulated substrate between conductor patterns (S). The thickness tL of the insulating layer on the conductor patterns is preferably 0.1-1 times the conductor thickness t1. The insulating layer is formed by printing a resin composition on the conductor patterns and on the insulated substrate between conductor patterns using screen printing, and subsequently curing. The resin composition has a viscosity of 50-300 P at 25°C, and a thixotropic index of 1.1-3.5. The screen printing plate used for screen printing has a thickness of at least 2.2 times the thread diameter.
Inventors:
ASAHINA YUJI (JP)
KOGISO TETSUYA (JP)
KODA TOMOHIRO (JP)
KIDO MASAYOSHI (JP)
KOGISO TETSUYA (JP)
KODA TOMOHIRO (JP)
KIDO MASAYOSHI (JP)
Application Number:
PCT/JP2017/015467
Publication Date:
October 26, 2017
Filing Date:
April 17, 2017
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
H05K3/28; B41F15/44; B41N1/24; C08F290/00
Domestic Patent References:
| WO2013111478A1 | 2013-08-01 |
Foreign References:
| JPH02308163A | 1990-12-21 | |||
| JP2001177200A | 2001-06-29 | |||
| JP2003268649A | 2003-09-25 | |||
| JP2016012002A | 2016-01-21 | |||
| JPH066016A | 1994-01-14 |
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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