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Patent Searching and Data


Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/070329
Kind Code:
A1
Abstract:
A printed wiring board according to one aspect of the present invention is provided with: a base film having an insulation property; and a conductive pattern including a plurality of wiring parts that are stacked on at least one surface side of the base film and are arranged in a row; and an insulating layer that covers the outer surface of the conductive pattern and the base film, wherein the plurality of wiring parts have an average interval of 1-20 μm and an average height of 30-120 μm, and the filling area percentage of the insulating layer between the plurality of wiring parts adjacent to each other in a cross-sectional view is not less than 95%. A method for manufacturing a printed wiring board according to another aspect of the present invention comprises: a step for stacking a conductive pattern on at least one surface side of the base film; a step for laying an insulating film on the outer surface of the conductive pattern and the base film; and a step for performing vacuum heat pressing for a stacked body obtained by having the insulating film laid thereon.

Inventors:
OKAMOTO Kohei (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
YAMAGUCHI Yoshihito (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
MIURA Kousuke (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
UEDA Hiroshi (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
KIMURA Atsushi (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
Application Number:
JP2017/036210
Publication Date:
April 19, 2018
Filing Date:
October 05, 2017
Export Citation:
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Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Koka-sh, Shiga 68, 〒5280068, JP)
International Classes:
H05K3/28; H01F17/00; H05K1/16
Attorney, Agent or Firm:
NISHIMA Hideaki et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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