PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2018/070329

A1

A printed wiring board according to one aspect of the present invention is provided with: a base film having an insulation property; and a conductive pattern including a plurality of wiring parts that are stacked on at least one surface side of the base film and are arranged in a row; and an insulating layer that covers the outer surface of the conductive pattern and the base film, wherein the plurality of wiring parts have an average interval of 1-20 μm and an average height of 30-120 μm, and the filling area percentage of the insulating layer between the plurality of wiring parts adjacent to each other in a cross-sectional view is not less than 95%. A method for manufacturing a printed wiring board according to another aspect of the present invention comprises: a step for stacking a conductive pattern on at least one surface side of the base film; a step for laying an insulating film on the outer surface of the conductive pattern and the base film; and a step for performing vacuum heat pressing for a stacked body obtained by having the insulating film laid thereon.

JP2003347735	METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
JPS5753916	MICROTRANSFORMER
JPH0969372	HEAT SEAL CONNECTOR

OKAMOTO KOHEI (JP)
YAMAGUCHI YOSHIHITO (JP)
MIURA KOUSUKE (JP)
UEDA HIROSHI (JP)
KIMURA ATSUSHI (JP)

PCT/JP2017/036210

April 19, 2018

October 05, 2017

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SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)

H05K3/28; H01F17/00; H05K1/16

JP2016174142A	2016-09-29
JP2004253684A	2004-09-09
JPS5750410A	1982-03-24
JP2007053174A	2007-03-01
JP2008166391A	2008-07-17

NISHIMA Hideaki et al. (JP)

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