Title:
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/216012
Kind Code:
A1
Abstract:
A printed wiring board according to an embodiment of the present disclosure comprises an insulating base film and a conductive pattern that is laminated upon at least one surface of the base film and that includes a plurality of parallelly disposed wiring parts, wherein: the average width of the plurality of wiring parts is between 5 μm and 15 μm, inclusive; the plurality of wiring parts each have an electroless plated layer and an electroplated layer that is laminated upon the electroless plated layer; and the void density of the interface between the electroless plated layer and the electroplated layer in cross section in the thickness direction of the plurality of wiring parts is no greater than 0.01 μm2/μm.
Inventors:
SAKAI SHOICHIRO (JP)
IMAZAKI EIKO (JP)
NITTA KOJI (JP)
IMAZAKI EIKO (JP)
NITTA KOJI (JP)
Application Number:
PCT/JP2019/008989
Publication Date:
November 14, 2019
Filing Date:
March 07, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C25D5/02; H05K3/18; C25D5/34; C25D5/56; C25D21/12
Foreign References:
| JP2003045871A | 2003-02-14 | |||
| JP2000080496A | 2000-03-21 | |||
| JP2004315889A | 2004-11-11 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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