Title:
PRINTED-WIRING BOARD AND METHOD OF MANUFACTURING PRINTED-WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/027022
Kind Code:
A1
Abstract:
The purpose of the present invention is to make it possible to form, in a printed-wiring board, a via sufficiently filled without residual smear, even when there are constraints in at least one of the material for use in an insulating layer and the size of the via to be formed. A via 2 of a printed-wiring board 100 comprises a first filling portion 21 which fills at least a center portion of a hole 11c, and a second filling portion 22 which fills a region of the hole that is not filled with the first filling portion. An interface I which exists between the second filling portion 22 and the first filling portion 21, or an interface I which exists between the second filling portion 22 and an insulating layer 11 and the first filling portion 21 has the shape of a truncated cone comprising a tapered surface Ia which is inclined so as to become thinner from a first surface 11a toward a second surface 11b, and an upper base surface Ib which is positioned in parallel to the second surface 11b and closer to the first surface 11a than to the second surface 11b.
Inventors:
NAGASE TOMOYA (JP)
SAEKI SHINRI (JP)
SAEKI SHINRI (JP)
Application Number:
PCT/JP2019/029584
Publication Date:
February 06, 2020
Filing Date:
July 29, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/46; H05K1/03; H05K1/11; H05K3/40
Domestic Patent References:
| WO2016114400A1 | 2016-07-21 |
Foreign References:
| JP2017107934A | 2017-06-15 | |||
| JP2008235624A | 2008-10-02 | |||
| JP2014154631A | 2014-08-25 | |||
| JP2015198128A | 2015-11-09 | |||
| JP2011035182A | 2011-02-17 |
Other References:
See also references of EP 3833165A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
Download PDF: