PRINTED WIRING BOARD PRODUCTION METHOD AND PRINTED WIRING BOARD

WIPO Patent Application WO/2014/038488

A1

The present invention addresses the issue of providing a printed wiring board production method and a printed wiring board that, even when metal foil layers provided on both surfaces of a thin insulating layer are interlayer-connected by a via hole having a bottom, are capable of suppressing warping of a double-sided metal clad laminate and variation in hole diameter and hole shape, and of achieving good interlayer connection. In order to solve this issue, a printed wiring board production method and a printed wiring board are provided, said production method characterized by comprising: a via hole forming step in which a laser is irradiated on the surface of a carrier foil on one side of a double-sided metal clad laminate comprising, on both surfaces of an insulating layer of no more than 200 µm and in order from the insulating layer side, a metal foil layer and the carrier foil having a thickness of no more than 15 µm, and a via hole with a bottom is formed, said via hole having the metal foil layer on the other surface side as the bottom section therefor; and a carrier foil separation step in which each carrier foil is separated from the surface of each metal foil layer, after the via hole with a bottom is formed.

YOSHIKAWA KAZUHIRO (JP)
TSUYOSHI HIROAKI (JP)
TATEOKA AYUMU (JP)

PCT/JP2013/073388

March 13, 2014

August 30, 2013

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MITSUI MINING & SMELTING CO (JP)

H05K3/42; H05K1/11; H05K3/00; H05K3/40

JPH0399490A	1991-04-24
JPS6476796A	1989-03-22
JP2008078487A	2008-04-03

YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)

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