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Title:
PRINTED WIRING BOARD PRODUCTION METHOD AND PRINTED WIRING BOARD PRODUCTION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/021599
Kind Code:
A1
Abstract:
A printed wiring board production method for forming a base film and an electroconductive pattern on said base film by an additive method or a subtractive method, wherein: the printed wiring board production method has a plating step for electroplating said electroconductive pattern on the surface of the base film; said plating step comprises a shielding plate placement step for disposing a shielding plate between an anode and a printed wiring board substrate that configures a cathode, and a substrate placement step for disposing said printed wiring board substrate in a plating tank; and the distance between the shielding plate and the printed wiring board substrate is 50 mm to 150 mm.

Inventors:
MOTOMURA Junichi (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
NITTA Koji (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
SAKAI Shoichiro (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
TAKAHASHI Kenji (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
IKEBE Maki (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
MIURA Kousuke (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
ITOH Masahiro (INC. 30, Hinokigaoka, Minakuchi-cho, Koka-sh, Shiga 68, 〒5280068, JP)
Application Number:
JP2018/019493
Publication Date:
January 31, 2019
Filing Date:
May 21, 2018
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (30 Hinokigaoka, Minakuchi-cho Koka-sh, Shiga 68, 〒5280068, JP)
International Classes:
C25D7/00; C25D17/10; H05K3/18
Foreign References:
JP2016211010A2016-12-15
JP2016195188A2016-11-17
JP2003242884A2003-08-29
JP2000087295A2000-03-28
Attorney, Agent or Firm:
NAKATA Motomi et al. (1-3, Shimaya 1-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
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