Title:
PRINTED WIRING BOARD RESIN COMPOSITION, PREPREG, RESIN SHEET, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/124161
Kind Code:
A1
Abstract:
The resin composition according to the present invention contains :an allylphenol compound (A); a maleimide compound (B); a cyanate ester compound (C); and/or an epoxy compound (D), in order to provide a printed wiring board resin composition that does not exhibit a clear glass-transition temperature (is Tg-less) and can satisfactorily reduce warping (achieves low warping) in printed wiring boards, in particular, multilayer coreless substrates, and in order to provide a prepreg, a resin sheet, a laminated plate, a metal foil-clad laminated plate, a printed wiring board, and a multilayer printed wiring board. In addition, the content of the allylphenol compound (A) is 10 to 50 mass parts per 100 mass parts of the resin solids in the printed wiring board resin composition, and the content of the maleimide compound (B) is 40 to 80 mass parts per 100 mass parts of the resin solids in the printed wiring board resin composition.
Inventors:
KUBO TAKASHI (JP)
HAMAJIMA TOMOKI (JP)
YAMAGUCHI SHOHEI (JP)
ITO MEGURU (JP)
SHIGA EISUKE (JP)
HAMAJIMA TOMOKI (JP)
YAMAGUCHI SHOHEI (JP)
ITO MEGURU (JP)
SHIGA EISUKE (JP)
Application Number:
PCT/JP2017/046843
Publication Date:
July 05, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L63/00; B32B5/24; B32B5/28; B32B15/08; B32B17/04; C08K5/13; C08L79/08; H05K1/03
Foreign References:
| JPH07278268A | 1995-10-24 | |||
| CN102643543A | 2012-08-22 | |||
| JPH0693047A | 1994-04-05 | |||
| JP2016141700A | 2016-08-08 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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