Title:
PRINTED WIRING BOARD SUBSTRATE, AND MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/004600
Kind Code:
A1
Abstract:
A printed wiring board substrate according to one embodiment is provided with: a base material layer; and a copper foil which is laminated, directly or indirectly, over at least some part of one or both surfaces of the base material layer. The base material layer includes a matrix consisting mainly of a fluororesin and one or a plurality of reinforcing material layers included in the matrix. When the average thickness of the base material layer is represented by A, and the average distance between the copper foil surface facing the matrix, and the reinforcing material layer surface closest to said surface and facing the copper foil is represented by B, the ratio B/A is 0.003 to 0.37.
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Inventors:
IWASAKI TOSHIKI (JP)
NAKABAYASHI MAKOTO (JP)
KIYA SATOSHI (JP)
NAKABAYASHI MAKOTO (JP)
KIYA SATOSHI (JP)
Application Number:
PCT/JP2021/024173
Publication Date:
January 06, 2022
Filing Date:
June 25, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
B32B27/20; B32B15/082; B32B15/18; B32B27/30; H05K1/03; H05K3/46
Domestic Patent References:
| WO2015182696A1 | 2015-12-03 |
Foreign References:
| JP2018011033A | 2018-01-18 | |||
| JP2017224758A | 2017-12-21 | |||
| JP2007055054A | 2007-03-08 | |||
| JPH08148780A | 1996-06-07 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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