Title:
PRINTED WIRING BOARD SUBSTRATE AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/194964
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a printed wiring board substrate having high adhesion between a metal layer and a resin film. A printed wiring board substrate according to an embodiment of the present invention is provided with a resin film and a metal layer that is layered on at least one surface of the resin film. The average diffusion depth of the main metal of the metal layer into the resin film after a weather resistance test in which the printed wiring board substrate is held at 150 °C for seven days is 100 nm or less. The average diffusion depth prior to the weather resistance test is preferably 80 nm or less.
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Inventors:
HASHIZUME KAYO (JP)
OKA YOSHIO (JP)
KASUGA TAKASHI (JP)
PARK JINJOO (JP)
UEDA HIROSHI (JP)
OKA YOSHIO (JP)
KASUGA TAKASHI (JP)
PARK JINJOO (JP)
UEDA HIROSHI (JP)
Application Number:
PCT/JP2016/066241
Publication Date:
December 08, 2016
Filing Date:
June 01, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/38; B32B15/08; B32B15/088
Foreign References:
JP2006287217A | 2006-10-19 | |||
JP2006104504A | 2006-04-20 |
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
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