PRINTED WIRING BOARD

WIPO Patent Application WO/2013/176133

A1

Provided are a surface-treated copper foil that adheres well to resins and imparts superior resin transparency after the copper foil is etched away, and a laminated board using the same. A surface-treated copper foil is bonded, from a side subjected to a roughening treatment, to both surfaces of a 50µm thick polyimide substrate (exhibiting a ΔB (PI), as set forth below, of 20-33 inclusive before the bonding of the copper foil), after which the copper foil on both sides is etched away. Printed matter onto which a linear mark is printed is laid out underneath the exposed polyimide substrate, and an image thereof is captured by a CCD camera above the polyimide substrate. Along the extension direction of the linear mark that is observed in the captured image and the direction perpendicular thereto, the brightness at every observation location is measured. On a graph of the observation location vs. brightness, the difference (ΔB) between the top mean value (Bt) and the bottom mean value (Bb) of a brightness curve between the edge of the mark until the area where the mark is not drawn is equal to or greater than 20, ΔB/ΔB (PI) is equal to or greater than 0.7, and the inclination of the brightness curve between the depths of 0.4ΔB and 0.6ΔB as based on the Bt, is 65-87°, inclusive.

ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI KOHSUKE (JP)
NAKAMURO KAICHIRO (JP)

PCT/JP2013/064096

November 28, 2013

May 21, 2013

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JX NIPPON MINING & METALS CORP (JP)

C25D7/06; B21B1/40; B21B3/00; C25D1/04; H05K1/09; H05K3/38

JP2011240625A	2011-12-01
JPH0987889A	1997-03-31

AXIS Patent International (JP)
Axis international patent business corporation (JP)

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