PRINTED WIRING BOARD

WIPO Patent Application WO/2015/178313

A1

A printed wiring board provided with: a first insulating substrate (11) produced from a liquid crystal polymer; a first signal line (131) formed on one principal surface (11a) of the first insulating substrate (11); a second insulating substrate (21) produced from a liquid crystal polymer; a second signal line (231) formed along the extension direction of the first signal line (131) on one principal surface (21a) of the second insulating substrate (21); and a bonding layer (30) produced from modified polyphenylene ether in order to bond the one principal surface (11a) of the first insulating substrate (11) and the one principal surface (21a) of the second insulating substrate (21), wherein when the frequencies of signals transmitted by the first signal line and the second signal line are 2.5-5.0 GHz inclusive, an offset amount (S) that is the distance from the position of one end of ends along the width direction of the first signal line (131) to the position of one end of ends along the width direction of the second signal line (231) is set longer than a circuit width (L1) of the first signal line (131) and set to 130-300 μm inclusive.

KOMATSU NAOMI (JP)

PCT/JP2015/064049

November 26, 2015

May 15, 2015

Click for automatic bibliography generation  

FUJIKURA LTD (JP)

H05K3/46; C09J171/12; H01P3/02; H01P3/08; H05K1/02

WO2014046014A1

2014-03-27

JP2009010328A	2009-01-15
JP2003101432A	2003-04-04
JP2011130395A	2011-06-30
JP2006042098A	2006-02-09

TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)

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