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Patent Searching and Data


Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/168952
Kind Code:
A1
Abstract:
A printed wiring board 10 of the present invention is provided with: a substrate 11 including a component mounting region 13, in which a first electronic component 40 or a second electronic component 50 is selectively mounted; a first conductor 20, to which a first terminal 41 of the first electronic component 40 or a first terminal 51 of the second electronic component 50 is connected; and a resist layer 12 formed on the surface of the substrate 11. The first conductor 20 includes pads 21-23, which are formed by covering a part of the first conductor 20 with the resist layer 12, the pad 21 of the first conductor 20 is formed in a shape that defines the position of the first terminal 41 of the first electronic component 40 in the cases where the first electronic component 40 is mounted in the component mounting region 13, and each of the pads 22, 23 of the first conductor 20 is formed in a shape that defines the position of the first terminal 51 of the second electronic component 50 in the case where the second electronic component 50 is mounted in the component mounting region 13.

Inventors:
KIMURA MASAYOSHI (JP)
KANEHIRA TOMOHIRO (JP)
YAMANAKA NORIYUKI (JP)
Application Number:
JP2017/001212
Publication Date:
October 05, 2017
Filing Date:
January 16, 2017
Export Citation:
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Assignee:
FDK CORP (?1088212, JP)
International Classes:
H05K3/34; H05K1/02
Foreign References:
JP2004022734A2004-01-22
JPH10294553A1998-11-04
JPH05102648A1993-04-23
JPH09331146A1997-12-22
JP2010278213A2010-12-09
JP2013009158A2013-01-10
Attorney, Agent or Firm:
NAGATO Kanji (5F Hyakuraku Bldg, 8-1 Shinbashi 5-chome, Minato-k, Tokyo 04, 〒1050004, JP)
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