Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/039237
Kind Code:
A1
Abstract:
This printed wiring board is provided with: an insulating base material layer; a first conductive layer which is laminated on one surface of the base material layer; a second conductive layer which is laminated on the other surface of the base material layer; and a via hole which is laminated on the inner circumferential surface of a connection hole that penetrates through the base material layer and the first conductive layer in the thickness direction, and which electrically connects the first conductive layer and the second conductive layer to each other. This printed wiring board is configured such that at least the cross-sectional shape of the connection hole in the one surface of the base material layer has an irregular shape.
Inventors:
KAIBUKI TADAHIRO (JP)
SATO DAISUKE (JP)
OYA HARUNA (JP)
YANAGIMOTO YOSHIAKI (JP)
KIMURA ATSUSHI (JP)
SHIMADA SHIGEKI (JP)
SATO DAISUKE (JP)
OYA HARUNA (JP)
YANAGIMOTO YOSHIAKI (JP)
KIMURA ATSUSHI (JP)
SHIMADA SHIGEKI (JP)
Application Number:
PCT/JP2018/029255
Publication Date:
February 28, 2019
Filing Date:
August 03, 2018
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K1/02; H05K1/11; H05K3/42
Foreign References:
| JP2013175504A | 2013-09-05 | |||
| JP2010251402A | 2010-11-04 | |||
| JPH0354884A | 1991-03-08 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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