Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/095797
Kind Code:
A1
Abstract:
This printed wiring board comprises: a first insulating layer having a first main surface and a second main surface opposite the first main surface; a first wiring pattern, a second wiring pattern, and a first ground pattern that are disposed on the second main surface and extend along a first direction in plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wiring pattern, the second wiring pattern, and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer side and a fourth main surface opposite the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer.
Inventors:
IGARASHI SHUN (JP)
KUWAYAMA ICHIRO (JP)
YAMAGISHI SUGURU (JP)
UEDA HIROSHI (JP)
KIYA SATOSHI (JP)
KUWAYAMA ICHIRO (JP)
YAMAGISHI SUGURU (JP)
UEDA HIROSHI (JP)
KIYA SATOSHI (JP)
Application Number:
PCT/JP2022/043213
Publication Date:
June 01, 2023
Filing Date:
November 22, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K1/02; H01P3/08; H05K3/46
Domestic Patent References:
| WO2021230215A1 | 2021-11-18 | |||
| WO2019116860A1 | 2019-06-20 |
Foreign References:
| JP2018200982A | 2018-12-20 | |||
| JP2006024618A | 2006-01-26 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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