Title:
PRINTED WIRING
Document Type and Number:
WIPO Patent Application WO/2018/070171
Kind Code:
A1
Abstract:
This printed wiring is formed from a cured conductive ink film formed on a surface of a base material, and configured by including at least: a single wavy line; a first wiring element that is positioned on one of opposite sides of the wavy line in the width direction; and a second wiring element that is positioned on the other one of the opposite sides adjacently to the wavy line, wherein an extra wavy line that is another wavy line is provided between the wavy line and the first wiring element so as to be adjacent to the wavy line, extended side by side with the wavy line, and connected to the wavy line to be at the same potential as the wavy line.
Inventors:
SAKAUE AKITOSHI (JP)
Application Number:
PCT/JP2017/032985
Publication Date:
April 19, 2018
Filing Date:
September 13, 2017
Export Citation:
Assignee:
JAPAN AVIATION ELECTRONICS IND LTD (JP)
International Classes:
G06F3/041; B41M1/34; G06F3/044; H05K1/02; B41M1/10; H05K3/12
Domestic Patent References:
| WO2014020862A1 | 2014-02-06 |
Foreign References:
| US20160202833A1 | 2016-07-14 | |||
| JP2015198108A | 2015-11-09 |
Attorney, Agent or Firm:
NAKAO, Naoki et al. (JP)
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