PRINTING DEVICE AND PRINTING METHOD

Title:

PRINTING DEVICE AND PRINTING METHOD

Document Type and Number:

WIPO Patent Application WO/2017/216951

Kind Code:

A1

Abstract:

In the solder printing machine according to the present invention, a force by which a squeegee 62 is pressed against a mask, that is, a printing pressure when a cream solder 110 is elongated, is smaller than a printing pressure when the cream solder is printed. Accordingly, a force by which the cream solder is pressed downward by the squeegee is weakened, so that the cream solder is spread along the squeegee, rather than pressed downward. In addition, the movement speed of the squeegee when the cream solder is elongated is higher than the movement speed of the squeegee when the cream solder is printed. Accordingly, the squeegee moves at high speed, and thus, the cream solder is spread along the squeegee before the cream solder is sufficiently pressed downward. Consequently, the cream solder can be suitably elongated in a direction in which the squeegee extends.

Inventors:

KINUTA MINORU (JP)
FUKAKUSA SHOJI (JP)
ASAOKA KENTO (JP)

Application Number:

PCT/JP2016/068084

Publication Date:

December 21, 2017

Filing Date:

June 17, 2016

Export Citation:

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Assignee:

FUJI MACHINE MFG (JP)

International Classes:

B41F15/42

Foreign References:

JPH11216840A	1999-08-10
JP2011212926A	2011-10-27
JP2007062079A	2007-03-15
JP2011159839A	2011-08-18

Other References: