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Title:
PRINTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/085268
Kind Code:
A1
Abstract:
This printer, for printing solder paste on the substrate using a mask, is provided with: a squeegee which slides on the mask and prints the solder paste onto the substrate through an opening in the mask; a cover which catches falling solder paste that was adhered to the squeegee; and a control unit which controls movement of the cover between a retracted position, in which the cover does not interfere with the squeegee sliding on the mask, and a catching position, in which the cover catches the falling solder paste that was adhered to the squeegee.

Inventors:
KURODA SEIYA
Application Number:
PCT/JP2021/028518
Publication Date:
April 28, 2022
Filing Date:
July 30, 2021
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B41F15/08; B41F15/40; H05K3/34
Foreign References:
JPH0715340U1995-03-14
JPH06210827A1994-08-02
JPH05162283A1993-06-29
JP2019034416A2019-03-07
JPH06206304A1994-07-26
Attorney, Agent or Firm:
Eikoh Patent Firm, P.C. (JP)
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