Title:
PROBE APPARATUS AND WAFER TRANSFER SYSTEM
Document Type and Number:
WIPO Patent Application WO/2014/109196
Kind Code:
A1
Abstract:
Provided is a probe apparatus that is capable of suppressing generation of a transfer error or the like by suction-holding a semiconductor wafer even in the cases where the semiconductor wafer has been warped. A probe apparatus (100) is provided with a measuring section (110), and a loader section (150), i.e., a transfer unit. The loader section (150) is provided with a wafer cassette (151) placed on a load port (152), a wafer transfer mechanism (160) having a wafer transfer arm (161), and a gas ejection mechanism (154) having a gas ejection nozzle (155). At the time when the wafer transfer arm (161) suction-holds a warped semiconductor wafer (W) in the wafer cassette (151), the gas ejection nozzle (155) ejects a gas from substantially a center portion on the upper side of the semiconductor wafer (W) toward the lower side of the semiconductor wafer, thereby reducing warpage of the semiconductor wafer (W).
Inventors:
OSUGA YASUHIRO (JP)
Application Number:
PCT/JP2013/084000
Publication Date:
July 17, 2014
Filing Date:
December 12, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B65G49/07; H01L21/66
Foreign References:
| JP2009099937A | 2009-05-07 | |||
| JP2003104547A | 2003-04-09 | |||
| JP2010264550A | 2010-11-25 | |||
| JP2000243814A | 2000-09-08 | |||
| JP2008004601A | 2008-01-10 | |||
| JPH01121930U | 1989-08-18 |
Attorney, Agent or Firm:
BECCHAKU Shigehisa et al. (JP)
Role of another Shigehisa (JP)
Role of another Shigehisa (JP)
Download PDF: