Title:
PROBE BONDING DEVICE AND PROBE BONDING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/026802
Kind Code:
A1
Abstract:
Provided are a probe bonding device and a bonding method using the same, the probe bonding device comprising: at least one tray on which a plurality of probes are loaded; a first gripper for gripping the probes loaded on the tray; a forming unit for receiving the probes from the first gripper and mechanically aligning the probes; a dipping unit having a solder bath in which a solder paste is accommodated; a chuck unit for fixing a substrate to which the probes are to be bonded; a second gripper for gripping the probes aligned by the forming unit, dipping the probes into the solder bath such that the solder paste is applied to lower parts of the probes, and moving the probes to a bonding position on the substrate; a laser unit for emitting laser beams so as to solder the probes to an electrode of the substrate; a first vision means for mapping positions of the probes loaded on the tray; a fourth vision means gripped by the second gripper so as to check whether the probes, which have been moved onto the substrate, are located at the correct positions to be bonded; and a control unit for controlling the second gripper and the fourth vision means, wherein the control unit sequentially controls the height of the second gripper and/or the fourth vision means at a predetermined interval, and enables the fourth vision means to photograph each one end of the probes a plurality of times so as to acquire information on the height of the probes from an upper surface of the substrate on the basis of a plurality of photographed images, thereby improving bonding quality of the probes and the quality of a probe card by enabling the probes to be bonded at accurate positions.
Inventors:
NAM G JUNG (KR)
LEE KANG SAN (KR)
LEE DAE SUB (KR)
YANG MIN SU (KR)
LEE KANG SAN (KR)
LEE DAE SUB (KR)
YANG MIN SU (KR)
Application Number:
PCT/KR2016/008806
Publication Date:
February 16, 2017
Filing Date:
August 10, 2016
Export Citation:
Assignee:
DAWON NEXVIEW CO LTD (KR)
International Classes:
G01R1/073; G01R1/067
Foreign References:
| KR100910217B1 | 2009-07-31 | |||
| JP2006071450A | 2006-03-16 | |||
| JP2006292647A | 2006-10-26 | |||
| KR101180350B1 | 2012-09-06 | |||
| KR200176166Y1 | 2000-03-15 |
Attorney, Agent or Firm:
LEE, Dong Yong (KR)
Download PDF:
Previous Patent: METHOD AND DEVICE FOR WLAN AGGREGATION CONTROL
Next Patent: PHOTORESIST STRIPPING SOLUTION COMPOSITION FOR LCD MANUFACTURING
Next Patent: PHOTORESIST STRIPPING SOLUTION COMPOSITION FOR LCD MANUFACTURING