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Patent Searching and Data


Title:
PROBE CARD, SEMICONDUCTOR MEASURING DEVICE, AND SEMICONDUCTOR MEASURING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/097629
Kind Code:
A1
Abstract:
A probe card (10) has an edge sensor (12). The edge sensor (12) has a first needle (14) and a second needle (16). The first needle (14) and the second needle (16) are in contact with each other when the first needle (14) and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card (10) has a resistor (18) that is connected between the first needle (14) and the second needle (16).

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Inventors:
MATSUBAYASHI HIROTO (JP)
MATSUMOTO TAKAYUKI (JP)
NAKAMURA TOMOAKI (JP)
Application Number:
PCT/JP2017/041278
Publication Date:
May 23, 2019
Filing Date:
November 16, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G01R1/067; G01R1/073; G01R31/26; G01R31/28; H01L21/66
Domestic Patent References:
WO2016159123A12016-10-06
Foreign References:
JPH01277780A1989-11-08
JPH01182756A1989-07-20
JP2006064572A2006-03-09
JP2005306353A2005-11-04
JP2009070771A2009-04-02
US20130076380A12013-03-28
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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