Title:
PROBE PIN FOR SEMICONDUCTOR INSPECTION DEVICES, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2012/008128
Kind Code:
A1
Abstract:
Provided is a probe pin for semiconductor inspection devices, wherein tin, which is the main component of a solder, is prevented from adhering to the contact section of the probe pin when the probe pin comes into contact with the solder, and a conductive film exhibiting excellent resistance to tin adhesion is formed on the surface of a base material. Specifically provided is a probe pin for semiconductor inspection devices which comprises a conductive base material and a copper-zirconium film containing copper and zirconium, wherein the proportion of the number of zirconium atoms relative to the total number of zirconium and copper atoms is 15 to 85 atom% in the copper-zirconium film, and the thickness of the film is 0.05 to 3 µm. Moreover, the copper-zirconium film also contains carbon atoms and, preferably, the proportion of the number of carbon atoms relative to the total number atoms in the copper-zirconium film is 40 atom% or less.
Inventors:
ITO, Hirotaka (())
伊藤 弘高 (())
伊藤 弘高 (())
Application Number:
JP2011/003911
Publication Date:
January 19, 2012
Filing Date:
July 07, 2011
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO (10-26, Wakinohama-cho 2-chome Chuo-ku, Kobe-sh, Hyogo 85, 〒6518585, JP)
株式会社神戸製鋼所 (〒85 兵庫県神戸市中央区脇浜町２丁目１０番２６号 Hyogo, 〒6518585, JP)
ITO, Hirotaka (())
株式会社神戸製鋼所 (〒85 兵庫県神戸市中央区脇浜町２丁目１０番２６号 Hyogo, 〒6518585, JP)
ITO, Hirotaka (())
International Classes:
G01R1/067
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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Claims:
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