Title:
PROBE SUBSTRATE AND ELECTRICAL CONNECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/148960
Kind Code:
A1
Abstract:
[Problem] To enhance durability between substrates of a probe substrate, and/or durability of the probe substrate and a member to be joined. [Solution] A probe substrate pertaining to the present invention has a plurality of electrical contacts brought into electrical contact respectively with a plurality of electrode terminals of an inspection object, wherein the probe substrate is characterized in that: in a joint with a member to be joined which is provided to any one or both of a first surface and a second surface of the probe substrate, the member to be joined is joined by a metal layer formed by sintering which includes at least 70 at% of a transition metal in the metal components thereof, and/or, on joining surfaces between a plurality of substrates of the probe substrate, the substrates are joined by the metal layer formed by sintering; and a plurality of organic component parts and/or gaps, formed by heating a bonding material composition including a thermoplastic resin, are present in the metal layer formed by sintering, the plurality of organic component parts and/or gaps included in the metal layer formed by sintering being 5-80 area% in a vertical cross section of the metal layer formed by sintering.
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Inventors:
OMORI TOSHINORI (JP)
GOTO KAZUYA (JP)
OSANAI YASUAKI (JP)
AKINIWA TAKASHI (JP)
SUGISAWA TAKEKI (JP)
KONDO TAKESHI (JP)
ABE SHINTARO (SG)
WATANABE MAKI (JP)
GOTO KAZUYA (JP)
OSANAI YASUAKI (JP)
AKINIWA TAKASHI (JP)
SUGISAWA TAKEKI (JP)
KONDO TAKESHI (JP)
ABE SHINTARO (SG)
WATANABE MAKI (JP)
Application Number:
PCT/JP2019/041156
Publication Date:
July 23, 2020
Filing Date:
October 18, 2019
Export Citation:
Assignee:
NIHON MICRONICS KK (JP)
TANAKA PRECIOUS METAL IND (JP)
TANAKA PRECIOUS METAL IND (JP)
International Classes:
G01R1/073; B22F7/08; C09J9/02; C09J201/00; G01R31/26; H01L21/66
Domestic Patent References:
| WO2017022523A1 | 2017-02-09 |
Foreign References:
| JP2008145238A | 2008-06-26 | |||
| JP2018078195A | 2018-05-17 | |||
| JP2016167527A | 2016-09-15 | |||
| JP2011175871A | 2011-09-08 | |||
| JP4155821B2 | 2008-09-24 | |||
| JP2018506496A | 2018-03-08 | |||
| JPH05279649A | 1993-10-26 | |||
| US20100134128A1 | 2010-06-03 | |||
| US5083697A | 1992-01-28 |
Attorney, Agent or Firm:
YOSHIDA Rintaro et al. (JP)
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