Title:
PROBE UNIT, CIRCUIT BOARD INSPECTION DEVICE, AND MANUFACTURING METHOD FOR PROBE UNITS
Document Type and Number:
WIPO Patent Application WO/2014/017426
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce manufacturing costs.
The invention comprises a plurality of probes (11) and a body portion (12) having support plates (41, 42), supporting tips (21) of the probes (11), and support plates (43, 44), supporting a base (23) of the probes (11). The support plates (41 to 44) are configured to be capable of moving from a first position, in which apertures of support holes (51 to 54) along the vertical direction overlap in mutual contact so as to be facing on a virtual line, to a second position, in which the support plates (41, 42) abut, the support plates (43, 44) abut, and the apertures of the support holes (52 to 54) are facing on a virtual line (A3) in a slanted direction when the support plates (42, 43) separate, and of maintaining that state. The probes (11), while in a state of being supported by the support plates (41 to 44) in the second position, are maintained in a state in which the tips (21) extend along a vertical direction and the portions excluding the tips (21) extend in a slanted direction.
Inventors:
KOBAYASHI MASASHI (JP)
Application Number:
PCT/JP2013/069772
Publication Date:
January 30, 2014
Filing Date:
July 22, 2013
Export Citation:
Assignee:
HIOKI ELECTRIC WORKS (JP)
International Classes:
G01R1/073; G01R31/02; H05K3/00
Foreign References:
| JP2008286788A | 2008-11-27 | |||
| JP2012078297A | 2012-04-19 | |||
| JP2010156648A | 2010-07-15 |
Attorney, Agent or Firm:
SAKAI, SHINJI (JP)
Shinji Sakai (JP)
Shinji Sakai (JP)
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