Title:
PROBE
Document Type and Number:
WIPO Patent Application WO/2016/072193
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a probe whereby increased density of electronic components, being the measurement target, is possible on a circuit board. The probe (1) is capable of simultaneously measuring a plurality of locations. The probe (1) comprises: a plurality of main body sections (30) including central conductors (20) that come in contact with a connector (300); and a first member (50) that bundles the plurality of main body sections (30). A recessed section (C1), having the tips of the plurality of central conductors (20) protruding from the bottom surface thereof, is provided in the first member (50). The recessed section (C1) has a sloping surface (S1) that spreads from said bottom surface towards an opening.
Inventors:
YUI TAKAYOSHI (JP)
Application Number:
PCT/JP2015/078268
Publication Date:
May 12, 2016
Filing Date:
October 06, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01R1/073; G01R1/067; G01R31/26
Foreign References:
| JPS613473U | 1986-01-10 | |||
| JPS61107166U | 1986-07-07 | |||
| JP2005050720A | 2005-02-24 |
Attorney, Agent or Firm:
PROFIC PC (JP)
Patent business corporation pro フィック patent firm (JP)
Patent business corporation pro フィック patent firm (JP)
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