Title:
PROCESS AND APPARATUS FOR PRODUCING SOLDER-PLATED WIRE
Document Type and Number:
WIPO Patent Application WO/2011/155477
Kind Code:
A1
Abstract:
A process and apparatus for producing a solder-plated wire are provided with which it is possible to stably obtain a plated wire of desired quality including sufficiently lowered 0.2% proof stress and to thereby improve product yield and production efficiency. The apparatus (10) is configured of: a plating pretreatment means (2) in which a copper wire (1a) is pretreated in preparation for plating; a plating means (61) in which the surface of the copper wire (1a) is plated with a solder; and a winding means (71) for winding the copper wire (1a, 1b) having the plated surface. The plating pretreatment means (2) includes a softening/annealing means (51) in which the copper wire (1a) is softened by annealing to reduce the proof stress. The copper wire (1a, 1b) having the lowered proof stress is wound by the winding means (71) at winding force lower than the proof stress of the copper wire (1a, 1b). The softening/annealing means (51), plating means (61), and winding means (71) have been arranged in series in this order from the upstream side along the running direction of the copper wire (1a, 1b).
Inventors:
WAKANA Katsutoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
若菜 勝敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
KAMIMURA Takatoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
上村 高敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
MASUI Takayuki (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
増井 隆之 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
TOMIMATSU Satoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
若菜 勝敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
KAMIMURA Takatoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
上村 高敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
MASUI Takayuki (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
増井 隆之 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
TOMIMATSU Satoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
Application Number:
JP2011/063008
Publication Date:
December 15, 2011
Filing Date:
June 07, 2011
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内２丁目２番３号 Tokyo, 〒1008322, JP)
RIKEN ELECTRIC WIRE CO., LTD. (12-22, Tsukiji 1-chome Chuo-k, Tokyo 45, 〒1040045, JP)
理研電線株式会社 (〒45 東京都中央区築地１丁目１２番２２号 Tokyo, 〒1040045, JP)
WAKANA Katsutoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
若菜 勝敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
KAMIMURA Takatoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
上村 高敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
MASUI Takayuki (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内２丁目２番３号 Tokyo, 〒1008322, JP)
RIKEN ELECTRIC WIRE CO., LTD. (12-22, Tsukiji 1-chome Chuo-k, Tokyo 45, 〒1040045, JP)
理研電線株式会社 (〒45 東京都中央区築地１丁目１２番２２号 Tokyo, 〒1040045, JP)
WAKANA Katsutoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
若菜 勝敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
KAMIMURA Takatoshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
上村 高敏 (〒22 東京都千代田区丸の内２丁目２番３号 古河電気工業株式会社内 Tokyo, 〒1008322, JP)
MASUI Takayuki (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
International Classes:
C23C2/38; B21C47/00; C23C2/02; C23C2/08; C23C2/10
Attorney, Agent or Firm:
NAGATA Yoshiaki et al. (NAGATA Patent Office, 7th Floor Shiroguchi Bldg. 2-15, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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Claims: