Title:
PROCESS FOR FABRICATION OF PRINTED CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO2005092043
Kind Code:
A3
Abstract:
A method of making a printed circuit board by coating a surface of a substrate with an electrically conductive polymer and curing or setting the polymer on the substrate. The polymer coating is laced with a catalytic reducing agent.
Inventors:
BOYACK JAMES A (US)
ROTH PETER H (US)
BERG N EDWARD (US)
ROTH PETER H (US)
BERG N EDWARD (US)
Application Number:
PCT/US2005/009428
Publication Date:
February 23, 2006
Filing Date:
March 21, 2005
Export Citation:
Assignee:
EPIC RES COMPANY INC (US)
BOYACK JAMES A (US)
ROTH PETER H (US)
BERG N EDWARD (US)
BOYACK JAMES A (US)
ROTH PETER H (US)
BERG N EDWARD (US)
International Classes:
B05D3/02; C23C18/16; C23C18/28; G03F9/00; H05K3/18; H05K3/46; (IPC1-7): B05D5/12; B32B3/00
Foreign References:
| US5830533A | 1998-11-03 | |||
| US5334292A | 1994-08-02 | |||
| US6007866A | 1999-12-28 | |||
| US4830880A | 1989-05-16 | |||
| US5373629A | 1994-12-20 | |||
| JPH07336022A | 1995-12-22 | |||
| JP2004031392A | 2004-01-29 |
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