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Title:
PROCESS FOR FORMATION OF PIEZOELECTRIC SYNTHETIC RESIN FILMS
Document Type and Number:
WIPO Patent Application WO/2008/007551
Kind Code:
A1
Abstract:
The invention provides a process for forming piezoelectric synthetic resin films at a low cost, particularly, a process for the formation of piezoelectric synthetic resin films by which piezoelectric synthetic resin films, particularly large ones, can be formed with small plant and equipment investment at a lowered manufacturing cost. The process is characterized by preliminarily synthesizing a resin having a degree of polymerization of 4 to 300 from a monomeric raw material for the synthesis of resins which have polar groups each containing at least one linkage selected from among urea linkage, ester linkage, amide linkage and imide linkage under the conditions of reaction temperature of 5 to 60°C, applying the synthesized resin to a substrate, and then polymerizing the resulting resin at 70 to 250°C while polarizing it to form a piezoelectric synthetic resin film on the substrate.

Inventors:
HABU, Takeshi (Inc. 1 Sakura-machi, Hino-sh, Tokyo 11, 1918511, JP)
羽生 武 (〒11 東京都日野市さくら町1番地コニカミノルタエムジー株式会社内 Tokyo, 1918511, JP)
Application Number:
JP2007/062890
Publication Date:
January 17, 2008
Filing Date:
June 27, 2007
Export Citation:
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Assignee:
Konica Minolta Medical & Graphic, Inc. (1 Sakura-machi, Hino-shi Tokyo, 11, 1918511, JP)
コニカミノルタエムジー株式会社 (〒11 東京都日野市さくら町1番地 Tokyo, 1918511, JP)
HABU, Takeshi (Inc. 1 Sakura-machi, Hino-sh, Tokyo 11, 1918511, JP)
International Classes:
C08J5/18; B29C41/12; C08G18/10; C08G18/32; B29L7/00
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