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Patent Searching and Data


Title:
PROCESS FOR INJECTION MOULDING POLYMER COMPOUNDS COMPRISING POLY (METH) ACRYLIMIDE FOAM PARTICLES
Document Type and Number:
WIPO Patent Application WO/2019/052360
Kind Code:
A1
Abstract:
Provided is a process for injection moulding a polymer compound comprising a thermoplastic resin which is melt processible at temperatures of less than 400°C, and poly (meth) acrylimide (P (M) I) foam particles which maintain the particulate form at a temperature at least 100°C higher than the Tg of the thermoplastic resin. The process includes steps of: (a) heating the polymer compound to a temperature 100-200°C higher than the Tg of the thermoplastic resin, and (b) injecting the polymer compound to a mould under an injection pressure of 100-3000 bar. The injection moulding obtained from the method achieves better mechanical performance than the individual components, and can be widely used in lightweight design.

Inventors:
WILLEMANN RICARDO LUIZ (DE)
KONG QIANWEN (CN)
HU PEI (CN)
LU HUIFENG (CN)
Application Number:
PCT/CN2018/103794
Publication Date:
March 21, 2019
Filing Date:
September 03, 2018
Export Citation:
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Assignee:
EVONIK SPECIALTY CHEMICALS SHANGHAI CO LTD (CN)
International Classes:
C08F220/44; B29C44/34; B29C45/76; C08F220/06; C08F220/50; C08J9/00
Foreign References:
CN103814068A2014-05-21
JPH05111933A1993-05-07
KR20150067743A2015-06-18
CN101611083A2009-12-23
CN102958662A2013-03-06
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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