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Patent Searching and Data


Title:
PROCESS FOR MANUFACTUING CONDUCTIVE FILM AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2014/087945
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a process for manufacturing a conductive film, said process being capable of achieving efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate; and a printed wiring board. This process includes: a step for applying a dispersion which contains metal oxide particles to a substrate to form a precursor film which contains the particles; and a step for irradiating the precursor film with a continuous-wave laser beam while scanning the laser beam relatively, and thereby reducing the metal oxide in an irradiated area to form a metal-containing conductive film. In the process, the scanning speed is 1.0m/s or more, the laser power of the continuous-wave laser beam is 6.0W or more, and the irradiation time per point on the surface of the precursor film is 1.0μs or more.

Inventors:
USAMI YOSHIHISA (JP)
OHTA HIROSHI (JP)
Application Number:
JP2013/082255
Publication Date:
June 12, 2014
Filing Date:
November 29, 2013
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B13/00; H01B5/14; H05K3/10
Foreign References:
JP2012178486A2012-09-13
JPH0537126A1993-02-12
JPS6433084A1989-02-02
JP2010534932A2010-11-11
JP2011047021A2011-03-10
JP2010528428A2010-08-19
JP2007330930A2007-12-27
JP2010528428A2010-08-19
JP2004143571A2004-05-20
JPH10204150A1998-08-04
JP2003222993A2003-08-08
Other References:
BONGCHUL KANG ET AL.: "One-Step Fabrication of Copper Electrode by Laser -Induced Direct Local Reduction and Agglomeration of Copper Oxide Nanoparticle", THE JOURNAL OF PHYSICAL CHEMISTRY C, vol. 115, no. ISSUE, 2011, pages 23664 - 23670, XP055201637
See also references of EP 2930722A4
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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