PROCESS FOR MANUFACTUING CONDUCTIVE FILM AND PRINTED WIRING BOARD

WIPO Patent Application WO/2014/087945

A1

The purpose of the present invention is to provide: a process for manufacturing a conductive film, said process being capable of achieving efficient progress of reduction of a metal oxide into a metal and yielding a conductive film which exhibits excellent adhesion to a substrate; and a printed wiring board. This process includes: a step for applying a dispersion which contains metal oxide particles to a substrate to form a precursor film which contains the particles; and a step for irradiating the precursor film with a continuous-wave laser beam while scanning the laser beam relatively, and thereby reducing the metal oxide in an irradiated area to form a metal-containing conductive film. In the process, the scanning speed is 1.0m/s or more, the laser power of the continuous-wave laser beam is 6.0W or more, and the irradiation time per point on the surface of the precursor film is 1.0μs or more.

USAMI YOSHIHISA (JP)
OHTA HIROSHI (JP)

PCT/JP2013/082255

June 12, 2014

November 29, 2013

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FUJIFILM CORP (JP)

H01B13/00; H01B5/14; H05K3/10

JP2012178486A	2012-09-13
JPH0537126A	1993-02-12
JPS6433084A	1989-02-02
JP2010534932A	2010-11-11
JP2011047021A	2011-03-10
JP2010528428A	2010-08-19
JP2007330930A	2007-12-27
JP2010528428A	2010-08-19
JP2004143571A	2004-05-20
JPH10204150A	1998-08-04
JP2003222993A	2003-08-08

BONGCHUL KANG ET AL.: "One-Step Fabrication of Copper Electrode by Laser -Induced Direct Local Reduction and Agglomeration of Copper Oxide Nanoparticle", THE JOURNAL OF PHYSICAL CHEMISTRY C, vol. 115, no. ISSUE, 2011, pages 23664 - 23670, XP055201637

WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)

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