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Title:
PROCESS FOR MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/135754
Kind Code:
A1
Abstract:
A process for manufacturing a light emitting device which can achieve high directivity with no cavity by minimizing occurrence of short circuit when a light emitting element is coated with glass. A light emitting device which can achieve high directivity with no cavity is also provided. After an LED mounted on a wiring board is provided, a glass member having a shape approximated by a rectangular parallelepiped or a sphere is mounted on the LED. Central axis of the glass member mounted on the LED is located in a region from the edge of the LED to an inside position with the central axis of the LED as the center, and the area of that region is set to be up to 90% of the entire surface for mounting the glass member. Thereafter, the glass member is softened by heat treatment to thereby cover the LED with the glass member, thus forming a shape where the central axis of the LED is substantially aligned with the central axis of the glass member in a self-aligned manner.

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JP2010132462GLASS COMPOSITION AND DISPLAY PANEL USING THE SAME
Inventors:
NAKAMURA NOBUHIRO (JP)
MATSUMOTO SYUJI (JP)
Application Number:
PCT/JP2006/319985
Publication Date:
November 29, 2007
Filing Date:
October 05, 2006
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
NAKAMURA NOBUHIRO (JP)
MATSUMOTO SYUJI (JP)
International Classes:
C03C3/14; H01L33/54; H01L33/58; H01L33/56
Domestic Patent References:
WO2004082036A12004-09-23
Foreign References:
JP2000353824A2000-12-19
JP2002305328A2002-10-18
JPH08102553A1996-04-16
JP2006054210A2006-02-23
JP2006054209A2006-02-23
JP2002151737A2002-05-24
JPH10303407A1998-11-13
JP2005136415A2005-05-26
JP2005254127A2005-09-22
JP2006111089A2006-04-27
JP2006072612A2006-03-16
JP2006139527A2006-06-01
Other References:
See also references of EP 2023408A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (SIA Kanda Square17, Kanda-konyacho, Chiyoda-ku, Tokyo 35, JP)
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