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Title:
PROCESS FOR PREPARATION OF ALICYCLIC DIEPOXY COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICAL INSULATING OILS, AND CASTING EPOXY RESIN COMPOSITIONS FOR ELECTRICAL INSULATION
Document Type and Number:
WIPO Patent Application WO/2004/035558
Kind Code:
A1
Abstract:
Epoxy resin compositions represented by the general formula (I) or (II), products of curing of the compositions, and a process for the preparation of the epoxy compounds through epoxidation with an organic percarboxylic acid: (I) (II) wherein R1 to R18 are each independently hydrogen, halogeno, a hydrocarbon group which may contain oxygen or halogen, or optionally substituted alkoxy.

Inventors:
MAESHIMA HISASHI (JP)
TAKAI HIDEYUKI (JP)
Application Number:
PCT/JP2003/011287
Publication Date:
April 29, 2004
Filing Date:
September 04, 2003
Export Citation:
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Assignee:
DAICEL CHEM (JP)
MAESHIMA HISASHI (JP)
TAKAI HIDEYUKI (JP)
International Classes:
C07D301/14; C07D303/04; C08G59/24; (IPC1-7): C07D301/19; C08G59/24
Domestic Patent References:
WO2002076966A12002-10-03
Foreign References:
JPS58172387A1983-10-11
GB2008593A1979-06-06
US5378736A1995-01-03
JPH05239043A1993-09-17
EP0844262A21998-05-27
JPS5032500A1975-03-29
JPS5335999A1978-04-03
JPH09176288A1997-07-08
Other References:
YU'VE V. P. ET AL.: "Oxidation of dienes by hydroperoxides", NEFTEKHIMIYA, vol. 12, no. 3, 1972, pages 353 - 357, XP002976221
Attorney, Agent or Firm:
Miura, Yoshikazu (4 Kojimachi 5-chom, Chiyoda-ku Tokyo, JP)
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