Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PROCESS FOR PRODUCING HIGH TEMPERATURE HEAT RESISTING CARRIER FOIL CLAD ELECTROLYTIC COPPER FOIL AND HIGH TEMPERATURE HEAT RESISTING CARRIER FOIL CLAD ELECTROLYTIC COPPER FOIL OBTAINED BY THE PROCESS
Document Type and Number:
WIPO Patent Application WO/2003/095714
Kind Code:
A1
Abstract:
A process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil from which detachment of a carrier foil is easy even after press working at 200ºC or higher. In particular, for example, a process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil, comprising forming an organic joint interface layer on a surface of carrier foil with the use of an organic agent and further forming an electrolytic copper foil on the organic joint interface layer, characterized in that in the formation of organic joint interface on the surface of carrier foil, a pickling solution containing 50 to 2000 ppm of an organic agent for formation of joint interface layer is applied so as to, while effecting acid cleaning and dissolution of the surface of carrier foil, cause the organic agent to be adsorbed thereon, thereby forming a pickling adsorption organic coating.

Inventors:
TAKANASHI AKITOSHI (JP)
IWAKIRI KENICHIRO (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
OBATA SHINICHI (JP)
DOBASHI MAKOTO (JP)
Application Number:
PCT/JP2003/005892
Publication Date:
November 20, 2003
Filing Date:
May 12, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI MINING & SMELTING CO (JP)
TAKANASHI AKITOSHI (JP)
IWAKIRI KENICHIRO (JP)
SUGIMOTO AKIKO (JP)
YOSHIOKA JUNSHI (JP)
OBATA SHINICHI (JP)
DOBASHI MAKOTO (JP)
International Classes:
B32B15/08; C25D1/04; C25D7/06; C25D1/20; H05K3/02; (IPC1-7): C25D7/06; H05K1/09; B32B15/08
Domestic Patent References:
WO1998051485A11998-11-19
Foreign References:
JP2000309898A2000-11-07
JP2000151068A2000-05-30
EP0996318A22000-04-26
EP0960725A21999-12-01
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chom, Bunkyo-ku Tokyo, JP)
Download PDF: