PROCESS FOR PRODUCING METAL PLATING FILM, PROCESS FOR PRODUCING ELECTRONIC PART AND PLATING FILM FORMING APPARATUS

WIPO Patent Application WO/2005/001166

A1

A process for producing a metal plating film, comprising providing a substrate with convex curved surface, depositing a metal plating film on the substrate surface and detaching the metal plating film from the substrate. The substrate surface on which the metal plating film is deposited is convex curved, so that the metal plating film of convex sectional configuration is formed on the substrate surface. Internal stress (tensile stress) occurs within the thus formed metal plating film, so that when the metal plating film is detached from the substrate and transferred on a dielectric sheet, the metal plating film is transfigured toward planarization. Therefore, on transfer recipient materials, such as the dielectric sheet, having a metal plating film transferred thereonto, deformation and damaging of such a metal plating film can be effectively prevented to thereby contribute to an improvement of production efficiency.

HIGASHIHARA NOBUHIRO (JP)
SAKODA HIDETO (JP)
NAKAGAWA ATSUYUKI (JP)
DAN YOSHIHARU (JP)
KITA KATSUNORI (JP)
IKEUCHI KOUICHIROU (JP)

PCT/JP2004/009353

January 06, 2005

June 25, 2004

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KYOCERA CORP (JP)
HIGASHIHARA NOBUHIRO (JP)
SAKODA HIDETO (JP)
NAKAGAWA ATSUYUKI (JP)
DAN YOSHIHARU (JP)
KITA KATSUNORI (JP)
IKEUCHI KOUICHIROU (JP)

C25D1/04; H01G13/00; H05K3/20; (IPC1-7): C25D1/04; H01G4/12

JP2000109993A	2000-04-18
JPH0888305A	1996-04-02
JP2002371382A	2002-12-26
JPH06302469A	1994-10-28
JP2001060528A	2001-03-06

Inaoka, Kosaku c/o AI Association of Patent and Trademark Attorneys (Sun Mullion NBF Tower 21st Floor, 6-12, Minamihommachi 2-chome, Chuo-k, Osaka-shi Osaka 54, JP)

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