PROCESS FOR PRODUCING MICROMACHINE, AND MICROMACHINE

WIPO Patent Application WO/2006/080226

A1

A process for producing a micromachine, in which the corrosion of structure can be inhibited; and a relevant micromachine. There is provided a process for producing a micromachine, characterized by including the step of conducting patterned formation of sacrificial layer (12) of a silicon oxide material containing hydrogen fluoride dissociation species on substrate (11); the second step of forming structure (16) on the substrate (11) so as to cover the sacrificial layer (12); the third step of making hole (18) through the structure (16) covering the sacrificial layer (12), the hole (18) reaching the sacrificial layer (12); and the fourth step of introducing either hydrogen fluoride gas only or hydrogen fluoride gas plus an inert gas only through the hole (18) to thereby etch the sacrificial layer (12) with the use of the dissociation species contained in the sacrificial layer (12) with the result that a vibration space is created between the substrate (11) and the structure (16). Further, there is provided a relevant micromachine.

OSAKA TSUTOMU (JP)
SATO SUSUMU (JP)

PCT/JP2006/300709

August 03, 2006

January 19, 2006

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SONY CORP (JP)
OSAKA TSUTOMU (JP)
SATO SUSUMU (JP)

H03H3/02; B81C1/00; H01L21/302; H01L41/09; H01L41/18; H01L41/22; H03H9/17

JP2002140075A	2002-05-17
JPH0964683A	1997-03-07
JP2001129798A	2001-05-15

Nakamura, Tomoyuki c/o Miyoshi International Patent (Office Toranomon Kotohira Tower, 2-8, Toranomon 1-chom, Minato-ku Tokyo 01, JP)

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