Title:
PROCESS FOR PRODUCING MOLD
Document Type and Number:
WIPO Patent Application WO/2011/158673
Kind Code:
A1
Abstract:
Provided is a process for producing a mold with which the surface of a molded article made of a resin composition containing a liquid-crystalline resin can be kept from fibrillating, and which is used to make a molded article having an excellent appearance. By deriving, through heat conduction analysis, the relationship between the temperature, near the surface of a mold cavity, of a liquid-crystalline resin filled in a mold and the retention time of the liquid-crystalline resin within the mold, a temperature range for the temperature of the resin near the cavity surface and a retention-time range for the retention time are derived such that no surface layer is formed on the skin layer of the molded article; and a thermal-insulation layer that allows said temperature range and said retention-time range to be satisfied is provided on the mold.
Inventors:
TAKASHIMA, Masato (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
高嶋 正人 (〒33 静岡県富士市宮島９７３番地 ポリプラスチックス株式会社内 Shizuoka, 〒4168533, JP)
MIYASHITA, Takayuki (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
高嶋 正人 (〒33 静岡県富士市宮島９７３番地 ポリプラスチックス株式会社内 Shizuoka, 〒4168533, JP)
MIYASHITA, Takayuki (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
Application Number:
JP2011/062827
Publication Date:
December 22, 2011
Filing Date:
June 03, 2011
Export Citation:
Assignee:
Polyplastics Co., Ltd. (2-18-1, Konan Minato-k, Tokyo 80, 〒1088280, JP)
ポリプラスチックス株式会社 (〒80 東京都港区港南二丁目１８番１号 Tokyo, 〒1088280, JP)
TAKASHIMA, Masato (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
高嶋 正人 (〒33 静岡県富士市宮島９７３番地 ポリプラスチックス株式会社内 Shizuoka, 〒4168533, JP)
ポリプラスチックス株式会社 (〒80 東京都港区港南二丁目１８番１号 Tokyo, 〒1088280, JP)
TAKASHIMA, Masato (973, Miyajima, Fuji-sh, Shizuoka 33, 〒4168533, JP)
高嶋 正人 (〒33 静岡県富士市宮島９７３番地 ポリプラスチックス株式会社内 Shizuoka, 〒4168533, JP)
International Classes:
B29C33/38
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (Sapia Tower, 1-7-12 Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
Claims:
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