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Title:
PROCESS FOR PRODUCING ORNAMENTAL PLATED ARTICLE WITH USE OF CONVERSION OF RESIN TO CONDUCTIVE ONE BY SPUTTERING, AND HANGING JIG FOR FIXING OF RESIN MOLDING
Document Type and Number:
WIPO Patent Application WO/2008/004558
Kind Code:
A1
Abstract:
Without the use of conventional chemicals, such as chromic acid, not only resin surface roughening but also conductivity imparting is attained for resin molding by a dry process. Accordingly, deterioration of the resin surface of resin molding by such chemicals is prevented. Further, as such chemicals imposing heavy environmental load are not used, reduction of environmental load substances can be attained. Still further, surface layer detachment from resin plated articles is prevented, thereby ensuring the safety thereof. There is provided a process including the resin surface cleaning/activation step (S1) of performing plasma treatment of the surface of resin molding to thereby attain cleaning and surface reforming activation; the metal thin film forming step (S2) of forming a metal thin film on the surface of the resin molding by sputtering; the conductivity imparting film forming step (S4) of forming by sputtering a conductivity imparting film of nickel, copper, etc. on the metal thin film formed on the resin molding; and finally the electroplating step of electroplating the resin molding.

Inventors:
KAKIHARA KUNIHIRO (JP)
NODA YOSHINORI (JP)
OURO TAKASHI (JP)
Application Number:
PCT/JP2007/063324
Publication Date:
January 10, 2008
Filing Date:
July 03, 2007
Export Citation:
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Assignee:
KAKIHARA KOGYO CO LTD (JP)
KAKIHARA KUNIHIRO (JP)
NODA YOSHINORI (JP)
OURO TAKASHI (JP)
International Classes:
C23C28/02; C23C14/02; C23C14/06; C23C14/50; C25D5/14; C25D5/56; C25D7/00
Foreign References:
JPH06212405A1994-08-02
JP2001104875A2001-04-17
JP2002293967A2002-10-09
JPH11185308A1999-07-09
JPH09157844A1997-06-17
JPH07292471A1995-11-07
JPH05311486A1993-11-22
JPH03229890A1991-10-11
Attorney, Agent or Firm:
TAKEMASA, Yoshiaki et al. (4-3 Mita 3-chom, Minato-ku Tokyo 73, JP)
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