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Patent Searching and Data


Title:
PROCESS FOR PRODUCING POLISHING COMPOSITION, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/012175
Kind Code:
A1
Abstract:
The present invention provides a process for producing a polishing composition with which a work can be polished at a high polishing rate with few scratches (defects). The present invention relates to a process for producing a polishing composition, the process comprising: preparing silica which, when analyzed by Raman spectroscopy, shows a peak assigned to the four-membered silica ring structure and a peak assigned to the silica random-network structure, the peaks respectively having intensities that satisfy a given requirement; and mixing the silica with a dispersion medium.

Inventors:
IZAWA, Yoshihiro (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
SUZUKI, Shota (1-1 Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-sh, Aichi 02, 〒4528502, JP)
Application Number:
JP2017/021694
Publication Date:
January 18, 2018
Filing Date:
June 12, 2017
Export Citation:
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Assignee:
FUJIMI INCORPORATED (1-1 Chiryo 2-chome, Nishibiwajima-cho Kiyosu-sh, Aichi 02, 〒4528502, JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Attorney, Agent or Firm:
HATTA & ASSOCIATES (Dia Palace Nibancho, 11-9 Nibancho, Chiyoda-k, Tokyo 84, 〒1020084, JP)
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