Title:
PROCESS FOR PRODUCING RESIST PATTERN, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2019/160101
Kind Code:
A1
Abstract:
Provided are: a process for producing a resist pattern; and a circuit board manufacturing method and a touch panel manufacturing method which include said process for producing a resist pattern. This process for producing a resist pattern includes: a step in which an outermost layer of a transfer material having a temporary support and a positive photosensitive resin layer, which contains a polymer and a photoacid generator, is brought into contact with a substrate and bonded to the substrate, said outermost layer being on a positive photosensitive resin layer side with respect to the temporary support; after the bonding step, a step for heating the positive photosensitive resin layer; after the heating step, a step for pattern-exposing the positive photosensitive resin layer; and a step for developing the positive photosensitive resin layer which has been pattern-exposed.
Inventors:
MATSUDA TOMOKI (JP)
YAMADA SATORU (JP)
ISHIZAKA SOJI (JP)
YAMADA SATORU (JP)
ISHIZAKA SOJI (JP)
Application Number:
PCT/JP2019/005642
Publication Date:
August 22, 2019
Filing Date:
February 15, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F20/18; G03F7/023; G03F7/039; G03F7/20; G03F7/38; G06F3/041; H05K3/06
Domestic Patent References:
| WO2008065827A1 | 2008-06-05 |
Foreign References:
| JP2000321775A | 2000-11-24 | |||
| JP2016057612A | 2016-04-21 | |||
| JP2008537597A | 2008-09-18 | |||
| JP2016046031A | 2016-04-04 | |||
| JP2006317501A | 2006-11-24 | |||
| US20170255100A1 | 2017-09-07 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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